搜索结果: 1-15 共查到“电子科学与技术 Reliability”相关记录15条 . 查询时间(0.062 秒)
An extended component-based reliability model for protective systems to determine routine test schedule
Reliability protective system routine test redundancy
2011/3/23
This paper presents a novel approach for evaluating the reliability of protective systems taking into account its components reliability. In this paper, a previously proposed extended model is used fo...
Managing Lithographic Variations in Design, Reliability, and Test Using Statistical Techniques
Control Structures Design for Manufacturability Electromigration Manufacturing Yield Photolithography Reliability
2014/11/7
Much of today's high performance computing engines and hand-held mobile devices are products of aggressive CMOS scaling. Technology scaling in semiconductor industry is mainly driven by corresponding ...
Oceanography radar system WERA: features, accuracy, reliability and limitations
Radar WERA Current Waves
2010/10/12
The WERA system (WavE RAdar) is a shore based remote sensing system to monitor ocean surface currents, waves and wind direction. This long range, high resolution monitoring system based on short radio...
The effect of the channel reliability factor in the MAP algorithm on turbo code performance in bluetooth systems
Turbo coding MAP algorithm channel reliability factor (Lc) bluetooth
2010/10/12
The effects of the channel reliability factor on the performance of turbo decoders that use a maximum a posteriori probability algorithm are investigated for wireless communication fading channels, su...
A Study on the Reliability of Polyester Insulators Blended with Borax
Electrical materials reliability surface tracking
2009/7/28
Tracking is the main factor which limits the safe working electric stress of insulation in power system applications. Polymer samples have been tested in laboratory conditions according to ASTM D2303 ...
The study of different stress on device characteristics of AlGaAs/InGaAs/GaAs PHEMTs has been researched and developed in this report. Many catastrophic degradation mechanisms such as hot-electron, ga...
Reliability Prediction of Thick Film Hybrid Integrated Circuits
Reliability Prediction methods Thick film ICs
2010/12/16
When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US milita...
Model for Reliability Prediction of Thick Film Resistors
Thick Film Resistors the random variable
2010/12/23
A model for time-to-failure prediction based on component parameter drift is described. The idea for creation of this model is based on the influence of time-dependent random and non random factors on...
Reliability Compliance Testing of Electronic Components for Consumer Electronics
Electronic Components Consumer Electronics
2010/12/23
In this paper the organisation of reliability compliance testing of electronic components in Poland is discussed. The aim of the testing is to find the reliability of the components to both producer a...
This paper considers the results of using tin or T/A platings as a substitute for gold in card-edge connectors. Measurements have been made on mated systems before and after various environmental test...
Reliability Assessment and Screening by Reliability Indicator Methods
Reliability Indicator Methods Built-in flaws electronic components
2010/12/23
Built-in flaws in electronic components have been recognized as a serious cause of failure. They are difficult to screen away by conventional methods because the times-to-failures for component workin...
Reliability Inspection of Electronic Components From the Point of View of the Users
Electronic Components View of the Users
2010/12/27
Reliability Inspection of Electronic Components From the Point of View of the Users.
Reliability Evaluation of Thick Film Resistors Through Measurement of Third Harmonic Index
Thick Film Resistors Third Harmonic Index
2010/12/28
The degradation mechanism of ruthenium-based thick film resistors is investigated in accelerated tests under various conditions of humidity, temperature and overload stress. This study shows that the ...
Reliability Considerations of Flip Chip Components for Automotive Electronic Applications
Flip Chip Components Automotive Electronic Applications
2010/12/28
Electronic devices for automotive electronic applications have to be operated under extreme environmental conditions and therefore are required to have higher reliability compared with general electro...
The quality and reliability of hybrid circuits is examined, with particular reference to the BS9000/CECC systems. It is shown that the capability approval approach developed within the BS9000/CECC sys...