搜索结果: 1-3 共查到“Chemical mechanical polishing”相关记录3条 . 查询时间(0.06 秒)
Feature-scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics
Chemical mechanical polishing smoothed particle hydrodynamics particulate flow rough pad wafer defects abrasive concentration
2014/10/10
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes are investigated in detail by the smoothed particle hydrodynamics (SPH) method. The feature-scale beh...
Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composite Abrasive
chemical mechanical polishing glass substrate α-alumina graft polymerization
2011/8/3
Abrasive is the one of key influencing factors during chemical mechanical polishing(CMP) process. Currently, α-Alumina (α-Al2O3) particle, as a kind of abrasive, has been widely used in CMP slurries, ...
Chemical mechanical polishing of titanium with colloidal silica containing hydrogen peroxide — mirror polishing and surface properties
Chemical mechanical polishing Titanium XPS
2009/9/11
Chemical mechanical polishing (CMP) of cpTi (Ti) was carried out using two types of slurries, acidic and basic colloidal silica containing H2O2 up to 3 wt%, to obtain flat and mirror-polished surfaces...