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Desktop simulation of MIT.nano die bonder enables virtual tool training（图）
MIT.nano芯片 虚拟工具培训 半导体器件
2023/6/6
Packaging is the final step in the process for manufacturing a semiconductor device. A critical tool for packing is the die bonder, which facilitates device assembly typically by attaching a chip in a...
西安电子科技大学集成电路测试技术课件第4章 模拟 simulation。
Modeling and simulation of luminescence detection platforms
Luminescence probes Modeling CMOS sensor Post-processing
2015/8/12
Motivated by the design of an integrated CMOS-based detection platform, a simulation model for CCD and CMOS imager-based luminescence detection systems is developed. The model comprises four parts. Th...
Simulation of Si CMES using synopsys sentaurus TCAD tools
Metal oxide semiconductor mechanical engineering inverter ion implantation model
2014/12/31
This paper is concentrated on the development of a complete complementary silicon MESFET technology. The basic difference between MOS and MES are pointed out and design criteria for CMES inverters usi...
Analysis and Simulation of Functional Stress Degradation on VDOMS Power Transistors
Functional Stress VDOMS Power Transistors
2010/12/7
The use of VDMOS transistor under certain functional stress conditions produces a modification of its physical and electrical properties. This paper explores the physical analysis and SPICE simulation...
Simulation of the Dynamic Transistor Negatrons
Dynamic transistor negatrons Volterra series Non-linear model Experimental oscillators
2010/12/8
The simulation principles of monolithic microwave dynamic transistor negatrons (circuits with negative differential active resistance) are introduced. The non-linear model has been developed on the ba...